GigaDevice cooperation with Hefei investment company research and development of DRAM

Date: 2017-10-31

Announced on Friday, GigaDevice innovation and hefei industrial investment holding (group) co., LTD. Signed on the storage of r&d project cooperation agreement, will undertake 19 nm process technology of memory (DRAM) research and development project, the budget is about 18 billion yuan, the goal is in the research and development success on December 31, 2018.

Needed for the project investment by GigaDevice innovation and hefei company according to the proportion of 1:4 responsible for raising, investment way including but not limited to, directly or indirectly, by both parties or equity investment by itself or to specify provide loan implementation main body.Capacity in the future, project development and production of DRAM GigaDevice priority for mega innovation such as sales and meet their customers' demand, as well as the priority to undertake the DRAM products OEM requirements.

GigaDevice innovation also issued three quarterly reports in 2017, business income is 1.517 billion yuan, up 44.69%;Net income of 339 million yuan, up 134.7402% from a year earlier.October 30, in early trading, mega easy innovation board harden a word (before today open 148.64, 135.13, or 10%).

Increase in recent years, the state of the storage industry of construction, and strengthening information security for data storage, industrial policies and support for the new project investment continues to heat up.From the state government releases the national integrated circuit industry development to promote outline, to the core national big fund/China investment has more than 50 projects, more than 40 companies, the pace of China's integrated circuit industry forward is underway.

In order to response to the call of national policy, and to speed up the localization of memory chips.GigaDevice innovation has plans to acquire the main DRAM, SRAM memory chip manufacturers such as ISSI, DRAM market.On August 3, but late GigaDevice innovation announced the termination of the purchase ISSI, backfire.Now sign easy to innovation and cooperative r&d investment company hefei 19 nm process technology of storage, incoming DRAM market again.

Related recommendation / 热点新闻
2018 - 02 - 06
点击次数: 0
Joinwin will participate in the spring of 2018 consumer electronics as show exhibitors, which is held by global sources . The exhibition time of the consumer electronics exhibition will be o...
2017 - 11 - 22
点击次数: 461262
H61-2ndCPU1. Supports 3rd Gen(IVY Brige). Intel® 22nm CPUs and 2nd Gen(Sandy Bridge). Intel® Core™ CPUs (LGA1155)Chipset1. Intel® H61 Express ChipsetMemory1. Supports DDR3 1600/...
2017 - 11 - 07
点击次数: 0
2017 New Arrival mining Motherboard H110 lga1151 price :$44.1/pcsProduct DescriptionCPUSupports 6/7rd Gen(lvy Bridge). Intel® Core™ CPUs (LGA1151)ChipsetIntel® H110 Express ChipsetMemorySupp...
2017 - 11 - 06
点击次数: 0
Special offer, ddr2 ddr3 ram promotion:Original chips PC DDR2 800 2GB 16C-FULL COMPATIBLE-$4.6 MOQ1000pcsOriginal chips PC DDR3 1333 4GB 16C-FULL COMPATIBLE-$24.3 MOQ500pcsEnjoy lifetime warranty,10...
2017 - 10 - 24
点击次数: 0
World famous e-sports peripherals overclocking memory and high-end leading brand, G.Skill, international published Ripjaws DDR4 SO - DIMM series new four-channel suit DDR4-3800 MHZ 32 gb (4 x8gb), ev...
2017 - 10 - 20
点击次数: 0
8gb ddr4 ram mini computer memory card promotion price:$89.60/pcsGolden memory ram all enjoy lifetime warranty,100% tested before delivery,Support Customized Logo,Retail Packing or Bulk Packing,ETT Or...
2017 - 08 - 09
点击次数: 0
Although Intel is not specialized in manufacturing the SSD, but its strength is very strong, in the enterprise market and Intel is very active, rich products, technology is also constantly breakthroug...
2017 - 10 - 13
点击次数: 0
2017 NEW GM sata3 2.5inch SSD 60GB promotion price: $29.5/pcsBased SpecificationControl chipSM2246ENInterfaceSATAIIICapacity60GBCache128MBFlash typeMLC NAND FlashRead/Write PerformanceSequential Read4...
2017 - 08 - 04
点击次数: 0
Toshiba 64 layers of stacked 3 d flash technology is practical, rapidly following the mainstream XG5 NVMe, low-end TR200 SATA, Toshiba and released the SSD, based on the new flash memory in the third ...
2017 - 07 - 20
点击次数: 0
4G 2133 REG ECC DDR4 SERVER RAM 22.00 8G 2133 REG ECC DDR4 SERVER RAM 84.50 16G 2133 REG ECC DDR4 SERVER RAM 158.30 32G 2133 REG ECC DDR4 SERVER RAM 289.00 32G 2133 REG ECC DDR4 SERVER RAM 305.50
Contact Us
  • joinwin1
  • +8613632905958
  • Room 906, 9/F Bantian Group commerical center, No. 20. LiShipai. Longgang district, Shenzhen. 


Copyright © 2013-2014 JOINWIN INDUSTRIAL DEVELOPMENT LIMITED. All Rights Reserved